Ontrack With Judy Warner

In this episode, our guest Joe Dickson, tells us about the cutting-edge technology implemented in advanced packaging at Wus Printed Circuit International.   Watch the episode here Show Highlights: Joe Dickson talks about what they do at Wus, a printed circuit manufacturing company He shares about their efforts to bring PCB technologies farther up by introducing advanced packaging options He briefly describes what printed circuit-like materials are, also known as the vertical interposers or PCIe Zach explains how a pre-packaged chip can be mounted on a board What are the reliability and signal integrity challenges that come with assembling different packages on a board Off-the-board solutions start to become more and more desirable  The flexibility of design and components is what driving the market to use more integrated packaging Speed is everything! When will the industry move on from copper and go to optical?  Knowing what's going on in simulations is very important; it opens opportunities to try new t